White Goods
November 2015
Microsemi, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, and PMC-Sierra, a semiconductor and software solutions leader in storage, optical and mobile networks, announced that they have entered into a definitive agreement under which Microsemi will ac
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Date:
11/30/2015
TMPM37AFSQG pre-driver
Toshiba Electronics Europe has expanded its TX03 series of ARM Cortex-M3-based microcontrollers with the launch of the TMPM37AFSQG. The new IC is presented as the world’s smallest vector control microcontroller that incorporates Toshiba’s Vector Engine Plus (VE+) coprocessor and a pre-driver to enable brushless DC
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Date:
11/30/2015
The Wuerth Elektronik eiSos Barcelona team
Wuerth Elektronik eiSos, manufacturer of electronic and electromechanical components, is increasing its presence on the Spanish market with the opening of the new Design & Application Centre in Barcelona. The establishment of the new branch in the Catalonian capital will also make it possible to devote mor
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Date:
11/26/2015
ROHM’s highly integrated Intelligent Power Modules
ROHM Semiconductor presents its latest IPM (Intelligent Power Module) family optimized for high speed and power-efficient operation in motor driving and inverter applications at SPS IPC Drives 2015. The 600V modules integrate a range of components such as gate drivers, bootstrap diodes, IGBTs or ROHM’s proprietary Lo
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Date:
11/26/2015
In this episode of PSDtv Infineon shows an advanced 3D printer made from 3D-printed parts and Infineon core technology. Every electronic system in the device is an Infineon component.
Infineon Technologies
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Date:
11/25/2015
In diesem Episode von PSDtv Infineon zeigt eine erweiterten 3D- Drucker, komplett gebaut mit Infineon Core-Technologie. Jedes elektronische System in der Vorrichtung nutz Infineon Komponenten.
Infineon
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Date:
11/25/2015
Infineon’s rugged TRENCHSTOP 5 S5 IGBTs extends operational lifetime and efficiency in PV & UPS apps
Infineon Technologies continues to improve IGBT performance with the release of their S5 (S for soft) family. It is based on the ultra-thin wafer TRENCHSTOP 5 IGBT. This family has been developed specifically for AC-DC energy conversion in industrial applications switching up to 40 kHz, typically to be found in
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Date:
11/12/2015
Microsemi, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, will be participating in the Electric Automation Systems and Components Conference (SPS IPC Drives) from Nov. 24-26, 2015 at the Nuremberg Messe in Germany. Microsemi will be showcasing its ex
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Date:
11/10/2015
Rutronik Elektronische Bauelemente is now the global distributor for switching technology specialist knitter-switch. The franchise agreement encompasses its entire product portfolio. Since it was founded in 1966, knitter-switch has specialized in switching technology and today offers an enormous selection of to
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Date:
11/10/2015
BM24 Series hybrid board-to-FPC connector system
Hirose, a leader in the development of innovative connector solutions, has launched a new hybrid power and signal connector designed for power line connection in various applications. The high-power BM24 Series board-to-flex printed circuit (FPC) connector features a unique, space saving design that concentrates po
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Date:
11/10/2015
Despite the development of ultralow power integrated devices, the overall demand for power at a system level is only increasing. At the same time, OEMs remain under pressure to make their end-applications physically smaller, which continues to drive demand for smaller and more efficient power supplies.
While improveme
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Date:
11/05/2015
When the first generation of silicon carbide (SiC) Schottky diodes was introduced more than 10 years ago, their widespread adoption was somewhat challenged by unforeseen dV/dt limitations within certain manufacturers’ devices. In particular, devices with lower dV/dt capability were susceptible to failure from larg
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Date:
11/05/2015
Guillaume Chansin, IDTechEx
Large investments have been made to enable flexible, thin sensors rather than rigid sensors. $75 million was recently awarded by the US Department of Defense to establish a new Manufacturing Innovation Institute (MII) for flexible hybrid electronics in San Jose, California. Under the acronym FHE MII, this new en
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Date:
11/01/2015
As modern power converters move towards higher efficiency, it is essential to have better models for all of the loss mechanisms in your components. In the first part of this article, we talked about the need for a single continuous equation to match the empirically measured losses. In this second part, the effect of
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Date:
11/01/2015
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