Soft-PGS enhances thermal coupling
Panasonic Automotive & Industrial Systems Europe has launched a highly-compressible Thermal Interface Material (TIM) to reduce contact thermal resistance between rough surfaces in extremely thin spaces. Soft-PGS enhances the thermal coupling between heat producing devices (heat sources) and heat dissipation
STM32 Open Development Environment
The STM32 Open Development Environment provides developers with end-to-end solutions to explore and validate design concepts. Using a combination of ODE components, it’s now possible to build a wireless sensor network based on 6LoWPAN connectivity leveraging a wide range of sensor technologies and make sensor
element14's electronic design community has launched a new Design Challenge for designers and engineers called ‘Safe and Sound’. Sponsored by Texas Instruments (TI), element14 will challenge 15 community members to design a personal safety-oriented wearable device or solution that protects a person from
Mouser Electronics, a leading New Product Introduction (NPI) distributor with a wide selection of semiconductors and electronic components, is now stocking the Cree XLamp MHB-B LEDs. These new high-power LEDs enable designers to more effectively deliver lower system costs for high-lumen, high-efficiency applications
Elma Electronic announced it has added EKF Elektronik, a premier designer of boards based on 3U CompactPCI Serial and PMC/XMC mezzanine standards, to its partner ecosystem. EKF brings 40 years of technical expertise in modular industrial computing to Elma’s portfolio of building blocks for embedded system
VOR hybrid solid-state relays
Vishay Intertechnology expanded its VOR family of hybrid solid-state relays with four new devices designed to deliver superior electrical characteristics for telecommunications, industrial, security system, and metering applications. Compared to similar solutions, the new Vishay Semiconductors 1 Form A VOR1121A6,
ECE80 series of 80W single output AC-DC encapsulated power supply modules
XP Power announced the ECE80 series of 80W single output AC-DC encapsulated power supply modules with high efficiency and a low no load input power. The modules are perfect for customers requiring an encapsulated AC-DC power solution in an ultra-compact format for either PCB, chassis, or DIN rail mounting.
TDK and Tronics Microsystems jointly announced that the all-cash public tender offer launched by TDK's wholly-owned subsidiary EPCOS was successfully closed on December 14, 2016. EPCOS, a leading manufacturer of electronic components, modules and systems based in Munich, Germany, acquired 72.38% of the outstanding
The MG / MGM Series from Stackpole is a high voltage thru hole resistor product with resistance values from 1K ohms up to 1G ohm. The metal glaze element provides working voltages ranging from 1600V up to 7000V, tolerances as low as 1% and 100 ppm TCR.
The MG / MGM Series ideal for all applications
The automotive and industrial supplier Schaeffler has today concluded a purchase contract with SEMIKRON International for the acquisition of 51% of the shares of Compact Dynamics, a manufacturer of high-performance electric motors. At the same time, Schaeffler and SEMIKRON have agreed a cooperation for the development
Ever-higher speeds and HF designs also place high demands on printed circuit board technology
At Nepcon 2017 (18-20 January 2017) in Tokyo, AT&S will be presenting innovative technologies as a response to current challenges in telecommunication, automotive electronics, wearables and medical electronics. Advancing miniaturisation, high data rates and/or high frequencies, power electronics with increasing
Solder on Polyester Substrate
Molex has introduced Solder on Polyester Substrate, a flexible, economical alternative to rigid PCB and polyimide. Surface Mount (SMT) components, including fine-pitched integrated circuits (ICs) are attached with low-temperature solder and encapsulated on a polyester substrate. Custom designed products can
UDZLV and KDZLV series high-voltage Zener diodes
ROHM has announced the development of high-voltage Zener diodes optimized for protection and constant current applications in a variety of electronic circuits. The UDZLV and KDZLV series are comprised of 12 models in Zener voltages ranging from 51V to 150V. They are also AEC-Q101 compliant and provide superior
In this PSDcast, Sani Ronen of Microsemi talks to Alix Paultre of Power Systems Design on enabling wireless infrastructures. The challenges when moving to higher bandwidths and frequencies place pressure on the related systems involved. In order to enable enterprises to migrate to these higher levels of
Spring Contact Development Kit
Harwin, the leading hi-rel connector and SMT board hardware manufacturer, is showcasing its new Spring Contact Development Kit for electronic design engineers and design houses at SPS IPC Drives. Harwin Spring Contacts are single contact, surface mount PCB devices with multiple uses including general electrical
With its tiny 1.2mm x 1.3mm outline and typical current of only 900nA, the TSU111 nano-power op-amp from STMicroelectronics helps cut the size and energy needs of analog circuits to the bare minimum in medical monitors, wearable electronics, gas detectors, pH sensors, infrared motion sensors, and payment tags.
EPCOS ERU SMT power inductors
TDK has extended its portfolio of EPCOS ERU SMT power inductors with the ERU16 choke series that comprises ten different types. The inductance values of the new B82559*A016 series extend from 1.0 µH to 30 µH and their saturation currents range from 9.2 A DC to 37 A DC.
The outstanding feature of
In today’s data acquisition systems (DAQs), performance boundaries are continually being pushed. System designers require higher speed, lower noise, and better total harmonic distortion (THD) performance; all of which are possible but none of which are free. These performance improvements typically
MEAS weather shield for Arduino/Genuino
Mouser Electronics, a leading New Product Introduction (NPI) distributor with a wide selection of semiconductors and electronic components, is now stocking the MEAS weather shield for Arduino/Genuino from TE Connectivity (TE), a global leader in connectivity and sensors. The MEAS weather shield integrates five
SensorTile has a complete Bluetooth Low-Energy transceiver including a miniature single-chip balun on-board
STMicroelectronics’ 13.5mm x 13.5mm SensorTile is currently the smallest turnkey sensor board of its type, containing a MEMS accelerometer, gyroscope, magnetometer, pressure sensor, and a MEMS microphone. With the on-board low-power STM32L4 microcontroller, it can be used as a sensing and connectivity hub
The creepage distance is the shortest path between two conductors along the surface of an isolator (typically a PCB)
When designing a switch-mode power supply (SMPS) operating losses and the ability to dissipate heat are critical selection criteria for MOSFETs. The standard TO-220 package is generally good at dissipating heat and the wide range of heatsinks and forced-air cooling options available can easily improve this.
Selco Products has been manufacturing custom cable and wire harnesses assemblies for many years for large OEM customers, and recently expanded its harness capabilities to meet custom designs from new and existing OEM customers. This has enabled Selco to support these customers from engineering design to rapid
Press-fit stacking connector
TE Connectivity, a leader in connectivity and sensors, recently released its press-fit stacking connector, a 56-position VPX footprint-compatible connector designed for rugged, high speed applications. Press-fit stacking connectors satisfy the need for 10Gb/s digital signals in high density packaging.
TB62269FTAG bipolar stepping motor driver
Toshiba Electronics Europe has introduced a high-voltage, high-resolution bipolar stepping motor driver with maximum ratings of 40V and 1.8A. The ultra-compact TB62269FTAG will suit applications ranging from home appliances and industrial automation to 3D printers and ATMs.
Supplied in a QFN32