White Goods
November 2016
Wearable Development Kit (WDK1.0)
ON Semiconductor, driving energy efficient innovations, has utilized its strength and depth in a broad range of semiconductor disciplines - including analog, power management, sensor interface and signal conditioning - to introduce a comprehensive development resource for the wearable electronics sector. The ne
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Date:
11/30/2016
The thermal image of the demonstrator indicates a slight temperature increase for the active components when operating at peak load.
Rutronik has developed a revolutionary new hybrid energy storage system (HESS) in collaboration with the University of Applied Sciences Zwickau (WHZ). The combination of battery and ultracapacitor improves the peak current characteristics of the energy storage system, minimizes battery degradation significantly, an
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Date:
11/30/2016
Transportation systems can have input voltage ranges up to 14V (single battery automotive), 28V (dual battery trucks, busses, airplanes), or higher, and require one or more low voltage rails for digital systems. As a result, designs of such systems need to know how they can step down from high input voltages si
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Date:
11/29/2016
Innovation is the driver of progress in industrial automation. From the conception of the programmable logic controller (PLC) in 1968 to the introduction of the collaborative robots we see in industry today, technological developments continuously shape the industrial automation landscape.
Internet of Things
A buzzwo
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Date:
11/28/2016
The LTM8055 is a buck-boost μModule® regulator with a 5V to 36V input range that can be easily paralleled to extend load current capability. Its 4-switch buck-boost topology features high efficiency while allowing the input voltage to be below, at or above the output—with smooth transitions between regulation mo
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Date:
11/28/2016
Lab4MEMS project team wins the 2016 Innovation Award during the European Nanoelectronics Forum
The Electronic Components and Systems for European Leadership (ECSEL) Joint Undertaking announced the Lab4MEMS project as the winner of its 2016 Innovation Award during the European Nanoelectronics Forum, in Rome, Italy.
At its launch in January 2014, Lab4MEMS was identified as a Key Enabling Technology Pilot-Lin
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Date:
11/26/2016
STK984-190-E Power Integrated Module
Mouser Electronics, a leading New Product Introduction (NPI) distributor with a wide selection of semiconductors and electronic components, is now stocking the STK984-190-E Power Integrated Module (PIM) from ON Semiconductor. Optimized for driving three-phase brushless DC (BLDC) motors in automotive applications, th
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Date:
11/25/2016
CQ series surface mount multilayer ceramic capacitors
Now available in Europe through TTI, a leading specialist distributor of electronic components, are Yageo’s CQ series surface mount multilayer ceramic capacitors (SMD MLCCs), also known as high quality factor capacitors (high-Q capacitors). The devices add copper inner electrodes and firing ceramic materials wi
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Date:
11/24/2016
BM620xFS Series High-Voltage Onboard Fan Motor Drivers
ROHM announced the availability of reference boards designed to evaluate its high voltage fan motor drivers that achieve greater efficiency and simplify inverter configuration in home appliances such as ceiling fans and ACs. Of the total power consumed worldwide, it has been noted that close to 50% is used to dr
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Date:
11/24/2016
LT8390 synchronous buck-boost DC/DC controller
Linear Technology announced the LT8390, a synchronous buck-boost DC/DC controller that can regulate output voltage, and input or output current from input voltages above, below and equal to the output voltage. Its 4V to 60V input voltage range and 0V to 60V output voltage range are ideal for voltage regulator, bat
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Date:
11/23/2016
The New York State Photonics Board of Officers today announced that Samtec, a global manufacturer of a broad line of electronic interconnect solutions, has become the latest member of AIM Photonics. Samtec will play a key role within the institute, providing expertise and leadership in prototyping and evaluating op
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Date:
11/23/2016
EEH-ZK series (Type V-ZK) Hybrid Aluminium Electrolytic Capacitors
Hybrid Capacitors from Panasonic Automotive & Industrial Systems Europe combine the advantages of electrolytic capacitors with those of solid Polymer capacitors, and have established themselves as reliant and across-the-board solutions in automotive and industrial applications alike. Hybrid technology offers lo
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Date:
11/22/2016
Wireless module from Microchip
Mouser Electronics, a leading New Product Introduction (NPI) distributor with a wide selection of semiconductors and electronic components, is now stocking the MRF24WN0MA and MRF24WN0MB wireless modules from Microchip. The low-power, 2.4 GHz, IEEE 802.11b/g/n-compliant transceiver modules interface with Microchip PIC3
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Date:
11/21/2016
ON Semiconductor, driving energy efficient innovations, has announced the expansion of the certification of its Sigfox wireless connectivity based solutions to the North American market at this year’s European Utility Week. This complements the existing certification of the robust, easy-to-use Sigfox products fo
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Date:
11/17/2016
Since the mobile era, touch screens have been at the core of our user interface with electronic devices. However, as the technology behind touch interfaces begins to saturate, many players now look beyond touch to the future of user interfaces. Whilst advanced solutions including voice and gesture detection, ri
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Date:
11/16/2016
DELTA Microelectronics, a European leader in ASIC supply chain services, announced that it has partnered with Solution in Silicon to augment UK sales and customer support. Solution in Silicon has a rich experience offering ASIC sales and support services to companies in a wide range of industries including consumer pr
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Date:
11/16/2016
MLF / MLFM metal film, surface mount MELF resistors
Stackpole's MLF / MLFM is a series of metal film, surface mount MELF resistors. The MELF technology provides cooler operating temperatures than flat chip resistors at full rated power. For example, the MLFM1 will typically run more than 70 degrees C cooler than the equivalent 1W 2512 size flat chip resistor and
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Date:
11/16/2016
Alex Lidow
In January of 2016 I made several predictions for the then-nascent year. Predictions were made for new markets such as wireless charging, augmented reality, autonomous vehicles, and advances in medical diagnostics and internet access. Progress in these markets was made on all fronts, sometimes faster and sometimes sl
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Date:
11/15/2016
MAX17681 converter
Wuerth Electronics Midcom announces the new series of isolated buck transformers for Maxim Integrated’s MAX17681 converter. These pick and placeable transformers, built on self-shielding packages, have small form factor and losses. The high efficiency MAX17681 converter eliminates the need for optocoupler fe
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Date:
11/15/2016
BL652 Bluetooth 4.2 and NFC module
Mouser Electronics, a leading distributor with a wide selection of semiconductors and electronic components, is now stocking the BL652 Bluetooth 4.2 and NFC module from Laird Technologies. This small, powerful, energy-efficient, standalone Bluetooth Low Energy (BLE) and Near Field Communication (NFC)-certified mo
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Date:
11/15/2016
Siemens is further building its Vision 2020 to shape Digital Industrial Enterprise by expanding its unique portfolio for industrial software. Siemens and Mentor Graphics announced that they have entered into a merger agreement under which Siemens will acquire Mentor for $37.25 per share in cash, which represents an
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Date:
11/14/2016
SKEDD reversible direct connectors
While direct mating with the edge of the printed circuit board using RAST connectors is one of the domains of Lumberg Group, the company is now introducing a totally new type of connectors: reversible direct connectors that mate anywhere on the printed circuit board using tried and tested insulation displacement te
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Date:
11/14/2016
Thermal runaway is no laughing matter
New research from the 6SigmaET team at Future Facilities, the leading thermal simulation tool provider, has found that 1 in 5 engineers confirm thermal issues are a common cause of expensive and time-consuming late stage design complications. Despite this, the survey of over 350 professional electronics engineers al
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Date:
11/14/2016
BGM12x Blue Gecko module
Silicon Labs has introduced the industry’s smallest Bluetooth low energy system-in-package (SiP) module with a built-in chip antenna, offering a complete, cost-effective connectivity solution with no compromises in performance. Available in a tiny 6.5 mm x 6.5 mm package, the BGM12x Blue Gecko SiP module enables de
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Date:
11/11/2016
DuPont Temprion non-silicone thermal grease
DuPont Electronic Materials today announced the launch of a new portfolio of thermal solutions under the brand name DuPont™ Temprion™ thermal management materials. The Temprion™ portfolio is completely non-silicone and currently includes thermal greases, thermal gap fillers, electrically insulating films an
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Date:
11/07/2016
1EDN EiceDRIVER gate driver ICs
Infineon Technologies introduced the 1EDN EiceDRIVER family of 1-channel low-side gate driver IC is well suited to drive MOSFETs, IGBTs, as well asand GaN power devices. Its pin-out and packages are fully compatible to the industry standard which eases the drop-in replacement for existing designs. Applications wh
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Date:
11/03/2016
Diana Goehringer of TULIPP
In this PSDcast, Diana Goehringer of TULIPP talks to Alix Paultre of Power Systems Design about next-gen energy-efficient embedded image processing. TULIPP's focus is to develop a reference platform for vision-based system designers that defines a set of guidelines for the selection of relevant combinations of
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Date:
11/03/2016
To read the November issue of PSDNA, simply click here
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Date:
11/03/2016
Heilind, a leading distributor of electronic components, announced it has rebranded its German operation and the MPS Group,acquired in April 2015, is now going to market under the Heilind banner as Heilind Electronics, with two divisions, Heilind Electronics and Heilind Electronics Mil/Aero. In the last 18 months Hei
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Date:
11/02/2016
FTDI Chip has established a new company called Bridgetek
In order to better serve the broadening range of markets it has developed products for, FTDI Chip has established a new distinct company - called Bridgetek. Presenting the embedded engineering sector with a well-defined and targeted operation, Bridgetek will drive the further commercialisation of some of th
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Date:
11/02/2016
Flatpack ruggedized flat aluminum electrolytic capacitors
Cornell Dubilier Electronics has introduced the latest in its series of Flatpack ruggedized flat aluminum electrolytic capacitor, the MLSG. This series targets compact power supply applications in military and aerospace, as well as other critical systems. Design enhancements and a new electrolyte push the MLSG to
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Date:
11/01/2016
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