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White Goods

 



 

 

White Goods

January 2018
WÃrth Elektronik eiSos at embedded world 2018
Würth Elektronik eiSos, manufacturer of electronic and electromechanical components, exhibits at embedded world (Nuremberg, February 27 – March 1, 2018). At booth 3-247, one of the biggest in hall 3 of the Nuremberg Exhibition Center, the company
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Date:
01/30/2018
Anglia strengthens display range with Mitsubishi

Yoshiaki Okamoto (Manager, Product Marketing Europe Industrial TFT – LCD. Mitsubishi), Xuesong Liu (Application Engineer Industrial TFT-LCD. Mitsubishi), Dr Ashley Rhodes (UK Sales Manager. Mitsubishi) and David Pearson (Technical Director, Anglia Components Limited)

Anglia Components today announced that it is has signed an agreement to distribute and support the Mitsubishi Electric range of displays in the UK and Ireland. The agreement greatly strengthens Anglia’s display portfolio, and extends its 10-year partnership
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Date:
01/30/2018
Omron releases new ultra-thin, highly durable tactile switch

The ultra-thin, highly durable tactile B3SE switch from Omron Components

Omron Electronic Components Europe is releasing a new ultra-thin sealed surface-mounting tactile switch rated at 1 million operations.
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Date:
01/30/2018

Mouser Electronics First Distributor to Stock ON Semi’s FDMF8811 110V Bridge Power Stage Module
Mouser Electronics is the first distributor to stock the FDMF8811 bridge power stage module from ON Semiconductor. The industry’s first 100 V bridge power stage module for half-bridge and full-bridge DC-DC converters, the FDMF8811 module uses high-performance PowerTrench
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Date:
01/30/2018
New microPEM Flaring Standoffs for Compact Electronic Assemblies
New microPEM MSOFS flaring standoffs from PennEngineering provide ideal miniature fastener solutions to attach and/or space components in compact electronic assemblies. They install permanently in thin panels of any hardness and material, including stainless steel,
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Date:
01/24/2018
Toshiba launches small LDO regulator ICs suitable for IoT applications
Toshiba Electronics Europe released the TCR3UG series of small package, low-dropout (LDO) regulators with an output current of 300mA, that are suitable for power management of IoT modules, wearable devices and smartphones.
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Date:
01/22/2018
Plug Connectors, Switches, Connection Technology â€
The new, expanded catalog of electromechanical components from Würth Elektronik eiSos is available in English and lists information on 12 standard product groups, including many innovations.  
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Date:
01/22/2018
The LTM®4636 is a 40A-capable μModule® regulator featuring 3D packaging technology, or component-on-package (CoP) to keep it cool - see Figure 1. The body of the device is an overmolded 16mm × 16mm × 1.91mm BGA package with an inductor stacked on top to expose it to cooling airflow. The total
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Date:
01/16/2018
When designing to meet the requirements of EN 60335, engineers have to adopt a different mind-set. Compared with the familiar IT and medical standards, not only are some design limits different but also the potential users and end products are much more varied. Unusually in safety evaluation, multiple faults
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Date:
01/14/2018
The holidays have flown by here, and 2018 is in full swing already. The APEC exhibition at the start of March in San Antonio is the place where every power company wants to be seen, and the whole industry seems to have sprung into action in preparation for it, including the US contingent at PSD. My colleagues
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Date:
01/13/2018
Welcome to 2018, power aficionados! With all the political, sociological, and ecological instability, it’s good to know you can turn to Power Systems Design for unwavering, uncompromising coverage of that which keeps the world running. And we’re starting the year off with one of the most fundamental of all
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Date:
01/13/2018
Addressing Differential and Common Mode Noise With Innovative Dual-Mode Choke Technology

CMF Series Dual Mode Chokes

Circuit designers must deal with many types of noise: internal, external, RF, line frequency and more. Noise can be a limiting factor in system performance and so must be addressed and minimized. The question is “at what cost and effort?”  Is it better to sacrifice performance or cost?  In either
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Date:
01/12/2018
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