Wide-Bandgap Semis

    June 2020
    4th Generation SiC MOSFETs Feature Lowest ON Resistance
    In recent years, the proliferation of next-generation electric vehicles (xEVs) has been accelerating the development of smaller, lighter, and more efficient electrical systems. In particular, improving efficiency while decreasing the size of the main inverter that plays a central role in the drive system remains a
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    Date:
    06/30/2020
    €10.3M project for the most energy-efficient GaN power modules
    CGD leads the European funded GANEXT project under the PENTA Programme, targeting the design and development on highly efficient, highly compact prototypes of next generation Gallium Nitride power modules, for low and high power applications. The GaNext Penta project is undertaken by a powerful consortium with co
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    Date:
    06/30/2020
    CoolSiC MOSFET 1700 V SMD offers best efficiency
    Having added 650 V to the portfolio earlier this year, the company is now launching the 1700 V class with its proprietary trench semiconductor technology. Maximizing the strong physical characteristics of silicon carbide (SiC), this ensures that the new 1700 V surface-mounted devices (SMD) offer superior reliabi
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    Date:
    06/30/2020
    PSDcast – GaN in Space

    EPC Space CEO, Bel Lazar

    Efficient Power Conversion Corporation has teamed up with VPT, Inc. to form “EPC Space,” and according to early PR, its mission is “designing and manufacturing radiation-hardened GaN-on silicon transistors and ICs packaged, tested, and qualified for satellite and high-reliability applications.”
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    Date:
    06/16/2020
    PSDwebinar Power Panel: Standing out from the Crowd
    Standing out from the Crowd! A deeper look into GaN & SiC products Hosted by Power Systems Design, featuring Cree, Power Integrations, United SiC, Analog Devices, and Infineon Now wide bandgap materials are established in the marketplace and being deployed in many applications, manufacturers are looking for ways
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    Date:
    06/11/2020
    KEMET Extends KC-LINK Range w/ High-Density Packaging Tech
    KEMET Corporation continues to strengthen its power conversion solutions by extending its popular KC-LINK range using KONNEKT high-density packaging technology to meet the growing demand for fast-switching wide bandgap (WBG) semiconductors, EV/HEV, LLC resonant converters, and wireless charging applications. Thi
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    Date:
    06/02/2020
    Archive

    Transformer Design Comparisons for Mitigating EMI in Gate Driver Circuits

    Mar 29,2026
    Matthew Russell, Master’s student at University College Cork, and a student engineer at Bourns Electronics Ireland

    Wide Bandgap Devices Deliver on Their Promise

    Jan 26,2026
    Kevin Parmenter, Pins Out Engineering, for TSC America, Inc.

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    Power Systems Design is a leading global media platform serving the power electronics design engineering community. It delivers in-depth technical content, industry news, and product insights to engineers and decision-makers developing advanced power systems and technologies.

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