Wide-Bandgap Semis

June 2020

4th Generation SiC MOSFETs Feature Lowest ON Resistance

In recent years, the proliferation of next-generation electric vehicles (xEVs) has been accelerating the development of smaller, lighter, and more efficient electrical systems. In particular, improving efficiency while decreasing the size of the main inverter that plays a central role in the drive system remains a

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Date:

06/30/2020

€10.3M project for the most energy-efficient GaN power modules

CGD leads the European funded GANEXT project under the PENTA Programme, targeting the design and development on highly efficient, highly compact prototypes of next generation Gallium Nitride power modules, for low and high power applications. The GaNext Penta project is undertaken by a powerful consortium with co

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Date:

06/30/2020

CoolSiC MOSFET 1700 V SMD offers best efficiency

Having added 650 V to the portfolio earlier this year, the company is now launching the 1700 V class with its proprietary trench semiconductor technology. Maximizing the strong physical characteristics of silicon carbide (SiC), this ensures that the new 1700 V surface-mounted devices (SMD) offer superior reliabi

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Date:

06/30/2020

EPC Space CEO, Bel Lazar

PSDcast – GaN in Space

Efficient Power Conversion Corporation has teamed up with VPT, Inc. to form “EPC Space,” and according to early PR, its mission is “designing and manufacturing radiation-hardened GaN-on silicon transistors and ICs packaged, tested, and qualified for satellite and high-reliability applications.”

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Date:

06/16/2020

PSDwebinar Power Panel: Standing out from the Crowd

Standing out from the Crowd! A deeper look into GaN & SiC products Hosted by Power Systems Design, featuring Cree, Power Integrations, United SiC, Analog Devices, and Infineon Now wide bandgap materials are established in the marketplace and being deployed in many applications, manufacturers are looking for ways

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Date:

06/11/2020

KEMET Extends KC-LINK Range w/ High-Density Packaging Tech

KEMET Corporation continues to strengthen its power conversion solutions by extending its popular KC-LINK range using KONNEKT high-density packaging technology to meet the growing demand for fast-switching wide bandgap (WBG) semiconductors, EV/HEV, LLC resonant converters, and wireless charging applications. Thi

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Date:

06/02/2020