Wide-Bandgap Semis

    January 2023
    200 V, 10 mΩ GaN FET Joins Family of Footprint Compatible QFN Packaged Devices for High Efficiency

    200 V, 10 mΩ GaN FET Joins Family of Footprint Compatible QFN Packaged Devices for High Efficiency

    ­EPC introduces the 200 V, 10 mΩ EPC2307 in a thermally-enhanced QFN in a tiny 3 mm x 5 mm footprint. The EPC2307 is footprint compatible with the previously released 100 V, 1.8 mΩ EPC2302, the 100 V 3.8 mΩ EPC2306, the 150 V, 3 mΩ EPC2305, the 150 V, 6 mΩ EPC2308, and the 200 V, 5 mΩ
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    Date:
    01/30/2023
    Navitas to Acquire Silicon Control IC Company

    Navitas CEO and co-founder Gene Sheridan

    ­Navitas Semiconductor announced an agreement to acquire the remaining minority interest in its silicon control IC joint venture from Halo Microelectronics for a purchase price of $20 million in Navitas stock. In 2021, Navitas and Halo created a joint venture to develop application-specific silicon c
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    Date:
    01/19/2023
    Design Higher Density and Lower Cost Lidar Systems with New 80 V, 15 A GaN eToF Laser Driver IC

    Design Higher Density and Lower Cost Lidar Systems with New 80 V, 15 A GaN eToF Laser Driver IC

    ­EPC announces the introduction of the EPC21701, a laser driver that monolithically integrates an 80 V, 40 A FET with gate driver and 3.3 logic level input into a single chip for time-of-flight lidar systems used in robotics, surveillance systems, and vacuum cleaners. It is tailored to lidar sy
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    Date:
    01/16/2023
    ROHM's Fourth Generation SiC MOSFETs to be Used in Hitachi Astemo's Inverters for Electric Vehicles

    ROHM's Fourth Generation SiC MOSFETs to be Used in Hitachi Astemo's Inverters for Electric Vehicles

    ­ROHM Semiconductor announced the adoption of its new fourth generation SiC MOSFETs and gate driver ICs in electric vehicle inverters from Hitachi Astemo, Ltd., a leading Japanese automotive parts manufacturer. As the electrification of cars rapidly advances towards achieving a decarbonized society,
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    Date:
    01/10/2023
    onsemi and Ampt Collaboration Increases Efficiency for Utility Solar Providers

    Simon Keeton, executive vice president and general manager, Power Solutions Group, onsemi

    ­onsemi and Ampt LLC announced their collaboration to meet the high demand for DC string optimizers. Ampt uses onsemi’s N-Channel SiC MOSFET, part of the EliteSiC family of silicon carbide (SiC) technologies, in its DC string optimizers for critical power switching applications. Ampt string op
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    Date:
    01/05/2023
    Silicon Carbide Family Solutions Deliver Industry-Leading Efficiency

    Silicon Carbide Family Solutions Deliver Industry-Leading Efficiency

    ­onsemi introduced “EliteSiC” as the name of its silicon carbide (SiC) family. The company is set to showcase three new members of the family – the 1700 V EliteSiC MOSFET and two 1700 V avalanche-rated EliteSiC Schottky diodes. The new devices provide reliable, high-efficiency performance for energy in
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    Date:
    01/03/2023
    GaN: Solving the Dual Challenge of Sustainability and Profitability in the Data Center

    Click image to enlarge

    Figure 1. GaN powers products across the data center, industrial, automotive, consumer electronics, and Hi-Rel

    ­Internet traffic has increased by nearly two billion new users in the past five years, creating challenging new demands on the overall Internet and cloud infrastructure. At the same time, cloud operators have significantly ramped technology investments in sustainability, scalability, and profitability. At the ce
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    Date:
    01/01/2023
    Archive

    Transformer Design Comparisons for Mitigating EMI in Gate Driver Circuits

    Mar 29,2026
    Matthew Russell, Master’s student at University College Cork, and a student engineer at Bourns Electronics Ireland

    Wide Bandgap Devices Deliver on Their Promise

    Jan 26,2026
    Kevin Parmenter, Pins Out Engineering, for TSC America, Inc.

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