Wide-Bandgap Semis
September 2024
STMicroelectronics Unveils New Generation of Silicon Carbide Power Technology Tailored for Next-Gen EV Traction Inverters
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, is introducing its fourth generation STPOWER silicon carbide (SiC) MOSFET technology. The Generation 4technology brings new benchmarks in power efficiency, power density and robustness. While se
. . . Learn More
Date:
09/24/2024
Axus Technology Delivers Industry’s Lowest Cost of Ownership for CMP Processes on 200mm SiC Wafers
Axus Technology, a leading global provider of chemical mechanical planarization (CMP) equipment, critical for semiconductor and compound semiconductor fabrication, today announced its flagship Capstone CS200 platform tools offer the industry’s lowest cost of ownership (CoO) for CMP processes on 200mm silicon ca
. . . Learn More
Date:
09/24/2024
ROHM and UAES Sign a Long-Term Supply Agreement for SiC Power Devices
ROHM Semiconductor and United Automotive Electronic Systems Co., Ltd. (UAES), a leading Tier 1 automotive supplier in China, today announced they have entered into a long-term supply agreement for SiC power devices.
Since 2015, ROHM and UAES have been collaborating and conducting detailed technical
. . . Learn More
Date:
09/06/2024
Archive
