Wide-Bandgap Semis
May 2025
Figure 1: Power schematic circuit for the bi-directional three-level, two-phase converter
Introduction
Modern power systems demand higher efficiency, increased power density, and reduced electromagnetic interference (EMI)—all while adhering to shrinking size constraints. Among the converter topologies addressing these challenges, the Flying Capacitor Multilevel (FCML) converter stands out for it
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Date:
05/30/2025
RECOM’s versatile and cost-effective ultra-wide input AC/DCs do not compromise on performance
RECOM has again pushed the boundaries of AC/DC performance with a miniature15W part that operates over a wide input range of 18-264VAC or 18-375VDC.
The board-mount RAC15-K/WI is just 1.5” x 2” (52.5mm x 40mm) footprint with an industry-standard pinout or optionally flying wires, and provides a range o
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Date:
05/29/2025
Pradeep Shenoy, the manager of power design services over at Texas Instruments
Today, we’re discussing power density in vehicles – specifically, hybrid and electric vehicles. As EVs and hybrids get ever more sophisticated, we’re starting to see the serious limitations of traditional silicon-based power devices and packaging…which is where wide band-gap devices come in. And on th
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Date:
05/22/2025
SemiQ Expands Gen3 SiC MOSFET Offering, Launches 1200 V TSPAK Series with Top-Side Cooling and Isolated Thermal Path
SemiQ Inc, a designer, developer, and global supplier of superior silicon carbide (SiC) solutions for ultra-efficient, high-performance, and high-voltage applications, has announced the expansion of its Gen3 SiC MOSFET offering, launching a 1200 V TSPAK-packaged series.
The four-strong series of Gen3 MOSFET
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Date:
05/07/2025
With the introduction of CoolGaN power semiconductors in the EasyPACK package, Infineon is now expanding the range of applications for gallium nitride.
With the rapid growth of AI data centers, the increasing adoption of electric vehicles, and the ongoing trends in global digitalization and reindustrialization, global electricity demand is expected to surge. To address this challenge, Infineon Technologies AG is introducing the EasyPACK™ CoolGaN™ Transistor 65
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Date:
05/02/2025
Click image to enlarge
Figure 1: One area these experts are excited about is the decarbonization of the grid, which involves transitioning away from fossil fuel power plants (like coal and oil)
Silicon carbide (SiC) has become a cornerstone for enhancing efficiency and supporting decarbonization across industries. It’s an enabler for advanced power systems, addressing growing global demands in renewable energy, electric vehicles (EVs), data centers and grid infrastructure. SiC technology has advantages ov
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Date:
05/01/2025
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