Wide-Bandgap Semis

May 2025

Figure 1: Power schematic circuit for the bi-directional three-level, two-phase converter

Optimizing Flying Capacitor Multilevel Converters for GaN Technology

Alejandro Pozo Arribas, Senior Applications Engineer, Efficient Power Conversion (EPC)

Introduction Modern power systems demand higher efficiency, increased power density, and reduced electromagnetic interference (EMI)—all while adhering to shrinking size constraints. Among the converter topologies addressing these challenges, the Flying Capacitor Multilevel (FCML) converter stands out for it

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Date:

05/30/2025

RECOM’s versatile and cost-effective ultra-wide input AC/DCs do not compromise on performance

15W AC/DC Power Modules feature Widest Input Range

RECOM has again pushed the boundaries of AC/DC performance with a miniature15W part that operates over a wide input range of 18-264VAC or 18-375VDC. The board-mount RAC15-K/WI is just 1.5” x 2” (52.5mm x 40mm) footprint with an industry-standard pinout or optionally flying wires, and provides a range o

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Date:

05/29/2025

Pradeep Shenoy, the manager of power design services over at Texas Instruments

PSDcast – Wide Band-Gap Devices Support Power Density in EV and Hybrid Vehicles

Today, we’re discussing power density in vehicles – specifically, hybrid and electric vehicles. As EVs and hybrids get ever more sophisticated, we’re starting to see the serious limitations of traditional silicon-based power devices and packaging…which is where wide band-gap devices come in. And on th

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Date:

05/22/2025

SemiQ Expands Gen3 SiC MOSFET Offering, Launches 1200 V TSPAK Series with Top-Side Cooling and Isolated Thermal Path

SemiQ Inc, a designer, developer, and global supplier of superior silicon carbide (SiC) solutions for ultra-efficient, high-performance, and high-voltage applications, has announced the expansion of its Gen3 SiC MOSFET offering, launching a 1200 V TSPAK-packaged series. The four-strong series of Gen3 MOSFET

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Date:

05/07/2025

With the introduction of CoolGaN power semiconductors in the EasyPACK package, Infineon is now expanding the range of applications for gallium nitride.

Infineon Expands its GaN Power Portfolio with EasyPACK CoolGaN Power Modules for High-Voltage Applications

With the rapid growth of AI data centers, the increasing adoption of electric vehicles, and the ongoing trends in global digitalization and reindustrialization, global electricity demand is expected to surge. To address this challenge, Infineon Technologies AG is introducing the EasyPACK™ CoolGaN™ Transistor 65

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Date:

05/02/2025

Click image to enlarge

Figure 1: One area these experts are excited about is the decarbonization of the grid, which involves transitioning away from fossil fuel power plants (like coal and oil)

Exploring How Silicon Carbide is Transforming Energy Systems

Michael Williams, director of marketing for industrial and infrastructure at Infineon Technologies AG and Shawn Luke, technical marketing engineer at DigiKey

Silicon carbide (SiC) has become a cornerstone for enhancing efficiency and supporting decarbonization across industries. It’s an enabler for advanced power systems, addressing growing global demands in renewable energy, electric vehicles (EVs), data centers and grid infrastructure. SiC technology has advantages ov

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Date:

05/01/2025