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Wide-Bandgap Semis & Packaging Technology

 



 

 

Wide-Bandgap Semis & Packaging Technology

Current
Gresham Power Electronics introduces a low profile 225 Watt Ultra High Density AC/DC ITE and Medical Power Supply
Gresham Power Electronics announces the introduction of its latest micro-footprint, Ultra High Density (UHD) 225W output power supply the OF(M)225. The OF(M)225 Series of open frame switching power supplies
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Date:
05/23/2018
WÃrth Elektronik successfully completing research project of assistance system with adaptive human-machine interaction  .
To make physically strenuous works easier was one of the aims. To give to the craftspeople additional information about the upcoming works, was another aim. The „third arm“ for craftsmen makes both possible: Effective support of the craftsman on the one hand
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Date:
05/23/2018
RS Components now stocking new series of high-efficiency fans and controllers from ebm-papst
RS Components (RS) has announced the availability of new energy-efficient fan controllers together with the 4300N series of fans from ebm-papst, one of the world’s leading makers of high-efficiency fans and motor products.
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Date:
05/23/2018

Infineon prepares for long-term growth and invests â1.6 billion in new 300-millimeter chip factory in Austria
Infineon Technologies is to build a new factory for power semiconductors. The market and technology leader in this segment will thereby create the foundation for long-term, profitable growth. A fully automated chip factory for manufacturing 300-millimeter thin wafers
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Date:
05/23/2018
TI’s LMZM3360x Power Modules, Now at Mouser, Integrate 36V Buck Converter and Power Circuitry in a Compact Package
Mouser Electronics is now stocking the LMZM33602 and LMZM33603 power modules from Texas Instruments (TI). These completely integrated 4 V–36 V power module solutions combine a step-down DC-to-DC converter with power MOSFETs, a shielded inductor, and passive components
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Date:
05/23/2018
May We Discuss GaN and SiC?

Jason Lomberg, North American Editor, PSD

Our May issue deals with Wide-Bandgap Semiconductors + Packaging Technologies, a compound topic that comprises two of the hottest themes in the industry – Gallium Nitride (GaN) and Silicon Carbide (SiC). If APEC was any indication, 2018 will be a SiC year, with GaN a close second. These topics are
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Date:
05/16/2018
No matter the technical innovation or application, all modern technologies have one thing in common; they rely on a reliable, small and high performance power supply to be able to function and meet their specification. As end products become more complex, the design parameters for the power supply become more
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Date:
05/11/2018
Wide Bandgap Semiconductors and Packaging
It’s forward thinking and necessary to have the terms “wide bandgap semiconductors” and “packaging” in the same sentence. Several years ago, I was involved in the emerging stages of wide bandgap semiconductor devices. In a meeting, I mentioned that device success in the marketplace required a focus
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Date:
05/09/2018
PSDcast â€
In this episode of the PSDcast, we’re talking to Levi Gant from Littelfuse about arguably the hottest topic in power electronics, silicon carbide. Littelfuse put out a comprehensive white paper titled “State of
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Date:
05/08/2018
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