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Figure 1: Projected electricity consumption of data centers (2015 – 2030) [6]
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Figure 1. 2013 Honda Accord Touring/Hybrid LED DRL & Headlamp
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Figure 1. DOE proposed regulations vs. Level V performance for a 5V output EPS.
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Figure 1: Daylight harvesting energy savings
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Figure 1. Forward operating mode of SBR structure
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Figure 1: Conventional vertical power loop PCB layout (a) Side view (b) MOSFET top view (c) eGaN FET top view
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Figure 1: Qi wireless-charging system simplified block diagram
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Figure 1: Hall-effect sensors can mount in three locations: inside the motor, at the end of the motor's shaft, and around the rotor shaft's ring magnet.
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Figure 1: Shoot through due to drive-signal timing mismatch
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Figure 1: Low-cost power supply providing a regulated 1.8 V and 2.5 V using a step-down converter and auxiliary charge pump
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Figure 1: Transformers that utilize the auto-zigzag construction can perform the delta to wye transformation without the efficiency loss of an isolation transformer.
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Figure 1: The SignalGuru application from MIT and Princeton, saves drivers an average of 20% fuel costs compared to those that had to stop at traffic lights.
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Figure 1: Typical CPU section and firmware memory map
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Figure 1: Projected relative cost of LED Luminaire and percentage due to the cost of LEDs (Source: DOE SSL 2011 Manufacturing Roadmap)
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Figure 1: A typical PoE system
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Figure 1: A network topology for wind-farm applications makes use of redundant devices and cabling to maximize system uptime and minimize the operational consequences of single points of failure.
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Figure 1: Shading and current distribution inside the solar module
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Figure 1: Wholesale energy prices will be increasingly driven by the weather.
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Figure 1: Micrel's MIC94300 integrated design reduces the combined footprint of filter and load switch by as much as 65%.
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Figure 1: Active Network Management creates a new layer of grid management.
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Figure 1: Inductor-current waveform
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Figure 1: SOA (a) and ZthJC (b) charts for the BSC014N04LS
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Figure 1: The DiSEqC application circuit
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Figure 1: Emerson Rosemount's 3051S series wireless instrumentation exemplifies the benefits WSN brings to industrial applications: It can reduce total installation costs by 45% and total deployment time by as much as 75%, eliminating design and installation time and cost associated with wiring, conduit, cable trays, and junction boxes.
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Table 1: SiC MOSFET and Si IGBT comparative specifications
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Table 1: The LTC2376 through 2380 pin-compatible family of differential, no-latency SAR ADCs are available in 16- and 18-bit versions.
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Figure 1: Transmission line circuit illustrating the impedance mismatch boundary between the transmission line and the load. Reflections occur at the boundary designated by ?. The incident wave is V+ and the reflective wave is V-.
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Figure 1: Optimising transient response parameters via a digital-power GUI.
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Figure 1: General usability-engineering design cycle
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Figure 1: Southampton hands. Across each palm can be seen a dc motor with a worm and wheel to rotate the thumb. Five other motors flex and extend the fingers and thumb. The fingertips have touch (force), slip/texture, and temperature sensors.
Figure 1: The 8-bit data registers in the SPI Master and Slave devices link through the MISO and MOSI signals to form a 16-bit control register. (Click image to enlarge.)
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Table 1: Process-control measures
Figure 1: The local-dimming function saves 10 to 20% of power on edge-lit systems (left) and 20 to 30% of power on direct back-lit TVs (right).
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Figure 1: Relative active power
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Figure 1a: Two TRIACs operating near their Tj(max): The BTB16-600CW standard TRIAC (a) and the T1635H-6T high-temperature TRIAC (b).
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Figure 1: Redundant 8.46 kV lines power an industrial customer's facility.
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Figure 1: Micro-inverters convert direct current from individual solar panels into alternating current for the electric grid.
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Figure 1: A conscientious life-cycle design will consider threats at every step of product development and manufacturing.
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Figure 1: Each stage of embedded-software validation for electric-motor simulation introduces new challenges for test engineers such as high-speed processing and high-power signals.
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Figure 1: EpiGaN deposits a unique in-situ SiN capping layer, grown by MOCVD on top of HEMT epi wafers.
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Figure 1: Functional blocks for amsï½s two-chip sensor interface for high-side automotive battery current sensing.
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Figure 1: An example of a shielded air-core open-loop current sensor from Raztec provides a strong combination of high performance in a small package and at low cost.
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Figure 1: Integrated gate driver with external passive components.
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Figure 1: Block diagram of a typical EPIC sensor
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Figure 1: Typical HEV system block diagram
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Figure 1: CAN network with partial-networking controllers during the transmission of a message to ECU7 (without partial-networking support)
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Figure 1: Communication line card primary ICs and power supply requirements
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Figure 1: A typical AES design includes power sources sharing a common high-voltage DC Link, an inverter for generating AC, and a system controller ensuring coordinated operation.
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Figure 1: Step-down converter efficiency used to power the main processor in a set top box
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Figure 1: The principle of fuel gauging based on coulomb counting: The stored energy represents state of charge. A circuit measures the in- and out-flowing current.
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Figure 1: Converter input power vs. line current with a symmetric conduction angle, constant current peak and resistive load.
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Figure 1: The activation steps of the MHP device
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Figure 1: Lighting controls for next generation lighting.
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Figure 1: Incandescent light bulbs (blue curves) are purely resistive, LEDs (red curves) are not.
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Figure 1: The LT3791 Driving a 3 A LED Array at up to 100 W
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Figure 1: Modern robotic systems featuring sophisticated multi-axis arms are adding to factory productivity and safety. Simply picking up an object can require several sensors.
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Figure 1: Resonant driver for high-power LED-lighting applications.
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Figure 1: One-Stage Approach: The driver converts an AC-rectified line voltage to the necessary DC current through a flyback transformer and filter. Unfortunately, the rectified voltage contains ripple at twice the line frequency (100 or 120 Hz).
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Figure 1: Development of CNA ASICs
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Table 1: Test comparison for PI Loops
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Figure 1 : Measured efficiency of a high frequency 12 Vin to POL buck converter, including output filter losses, using low voltage GaN based power devices.
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Figure 1: AMIS-30522 Functional Block Diagram
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Figure 1. Block Diagram of the ISL29028A ambient light and proximity sensor
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Figure 1: Different PFC circuits
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Figure 1: Example PLD, with 12 inputs, 8 product terms and 4 macrocells
PLDs can have hundreds of macrocells with up to 16 product terms driving each macrocell. The AND and OR gates within the product terms can be interconnected to form highly flexible custom logic functions. The macrocells are typically clocked, and their outputs can be fed back into the product term array. This allows state machines to be created.
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Figure 1 - Development of Converged Network Adapter ASICs
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Figure 1: Difference between a DCP and SDP
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Figure 1: Typical application circuit, using 2 AA batteries and a regulator IC, the AS1337, to produce a 3.3V output
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Table 1. IEC 61000-3-2 Classifications
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Figure 1. A flyback converter's main common-mode noise sources and transfer paths.
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At least two power reactors are needed for solar inverters: one in the boost converter (step-up chopper) and one at the ouput of the inverter for EMC filtering. Besides the IGBTs, the losses in the reactors are a major determining factor of the overall efficiency of the inverter
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Figure 1: NetRiver desired a solution capable of easily scaling to match its unpredictable future growth.
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Figure 1: High output current 1.5V/50A application schematic
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Figure 1: Example PLD, with 12 inputs, 8 product terms and 4 macrocells
PLDs can have hundreds of macrocells with up to 16 product terms driving each macrocell. The AND and OR gates within the product terms can be interconnected to form highly flexible custom logic functions. The macrocells are typically clocked, and their outputs can be fed back into the product term array. This allows state machines to be created.
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Figure 1: With the new XMC4000 family - starting with the XMC4500 series - Infineon addresses three high-level trends for microcontrollers in industrial applications: higher energy efficiency, enhanced connectivity and reduced software complexity
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Figure 1
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Figure 1: Optocoupler Construction
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Figure 1: Five steps of working with the SupIRBuck® Online Design Tool
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Fig. 1 - The ON Semiconductor NCV47701 Current Sense Regulator Implementation
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Figure 1. How intellectual property, intellectual assets and intellectual capital work together
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Figure 1: Harmonic Performance
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Figure 1: Development of Converged Network Adapter ASICs
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Figure 1: Power budget
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Figure 1: Internal structure of the ITRIP and RCIN sections
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Figure 1. CAPZero high-level functional diagram
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Figure 1: Typical solar power system diagram
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Figure1: The test circuit used for all turn-off measurements Lcomm= 3.2 μH?Configuration 1: Cclamp = 10 μF, Rclamp = 0.625 ?, L? = 330 nH?Configuration 2: Cclamp = 20 μF, Rclamp = 0.37 ?, L? = 325 nH
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National Wind Energy Centre
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At least two power reactors are needed for solar inverters: one in the boost converter (step-up chopper) and one at the ouput of the inverter for EMC filtering. Besides the IGBTs, the losses in the reactors are a major determining factor of the overall efficiency of the inverter
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Figure 1: Typical off-grid PV system
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Figure 1: Single-phase anti-tamper smart meter
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Figure 1: Typical Solar Panel Output Current & Power vs. Output Voltage Curve
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Figure 1a: State-of-the-art configurations
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Figure 1: A wireless handset may need to cover 13MHz to 6GHz in future - figures show the Murata estimate for the take-up of various technologies
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Figure 1: Offshore wind park ï½Lillgrundï½ in Sweden is connected to the main land via a 138kV high-voltage DC link (picture: Siemens)
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Figure 1a: The effects of parallel connecting two power supplies without share control
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Figure 1: GUI view of Auto Compensation page
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Figure 1: Supplies are margined by changing the resistor connected to the Trim/FB node
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Figure 1: JenNet-IP Stack build-up
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Figure 1: Auto-Control Adapts to Power Stage Variations
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Figure 1: In a typical rack, the system host provides overall control for each board's power system via a Board Power Manager.
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Figure 1: Typical PoE system
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Figure 1: An example of the simplification of an RF design using an integrated front-end module
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Figure 1: The Total Energy Management approach to design
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Figure 1: Typical Solar Panel Output Current & Power vs. Output Voltage Curve
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POWERVAR SecurityPlus product
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Figure 1
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LTM2881 2.5kVRMS isolated RS485 μModule transceiver
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Figure 1
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Analysis of insulator covered with water droplets
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Figure 1: Broadband attenuation
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Table 1: Turns Ratios and Inductances
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Fig 1 LED Driver
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Figure 1: The RIDLEY UNIVERSAL INJECTOR offers extraordinary wideband operation with either large voltage drive, or high current drive.
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Implementation of a RightWon in a small distribution substation connecting IEDs, a meter and sensors located on the transformers within the substation
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Figure 1: A typical small cell cabinet with power system and battery backup included (top left side)
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Figure 1: Islanding
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Figure 1
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Figure 1: Dimming ballast block diagram.
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Figure 1: Scheme for PLC technology. In a TLACS system from Nyx Hemera Technologies a local controller integrates PLC to communicate with the network controller over the AC line and controls each lamp using a standard DALI interface
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Figure 1
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Wi-LEM Schematic illustration
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Figure 1: Switching frequency vs. switching transitions
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Figure 1 - ISL28134: 0.1Hz to 10Hz Peak-to-Peak Noise Voltage
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Figure 1: Single-Stage, Single-Phase Inverter Block Diagram
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Figure 1: Traditional Approach of Remote Voltage Sensing
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Smart Grids need to modern passive components
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Typical high quality rooftop installation
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Figure 1: Automotive Electronics Forecast and Semiconductor Content per Vehicle (Source: Gartner - March 2011)
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Figure 1: Supply lines - eliminate loops and decouple at local boundaries
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Figure 1: Structure of the SaberRD environment
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Table 1: Teseo-II Urban Canyon Performance
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Figure 1: The Die Free package resistances of different power semiconductor packages
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Figure 1: The new innovative body architecture allows a significant wire harness reduction in comparison to today's architecture
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Figure 1: Ballast-Igniter Circuit
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Figure 1: Typical positioning of high-voltage vehicle components
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Figure 1: Principle of Car Wiring Harness Pulse Immunity Test Using an ESD Simulator ("ESD Pulse Gun")
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Figure 1: Boost Buck Structure
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Figure 1: Typical LTC3859A Start/Stop Application Schematic
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Figure 1: Spectrum of a 250A DC charger used for testing G3-PLC operation
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Figure 1: LTC4070 Typical Application Circuit
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Figure 1: National Semiconductor's diverse analog IC product offering for PV
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Efficiency Chart
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Figure 1: Power-Voltage Curve of a photovoltaic cell for differing light levels
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Figure 1
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Figure 1: Method of implementing the smart grid which does support deregulation
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Figure 1: By using software from ANSYS to predict maximum temperatures and temperature distribution within its new diesel particulate filter under diverse conditions, Cummins engineers can ensure that the manufactured component will have acceptable durability.
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Ruggedized, Fast/Gigabit Ethernet rack-mount switches, such as this Hirschmann MACH1000, offer high port density and hundreds of copper/fiber media-mix options, excellent RFI/EMI shielding, and high performance - even in the harshest industrial environments and applications
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Figure 1: Application range of high power modules. A different optimization of devices is required, indicated by the attributes "soft" and "fast"
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Figure 1: The challenge of dynamic performance vs. current consumption has been addressed by introducing parts that are switchable between low power mode and high performance. A typical example is ON Semiconductor's NCP4587.
Looking at products that are currently sampling, it appears that products with noise in the 10 ?VRMS range and Quiescent current in the 10-15 μA range will be in production by the end of this year, giving cell phone designers the best of both worlds in selecting their LDOs.
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Figure 1: LT3748 Flyback Converter with Primary-Side Output Voltage Sensing
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Available in serial or parallel wiring options, the new Molex array holder simplifies LED installation. Array holder is shown with and without optional Ingress Protection
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Figure 1: N and P type doping of an LED
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Figure 1: CAMEL Card validator and PCB detail
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Table 1: Comparison of LEDs, CFL & Incandescent Light Sources
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Figure 1: LED street lights
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Figure 1: Single Stage Equalizer for 300 meters of Cat 5 cable
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Figure 1: Estimated junction temperature rise for a given power pulse assuming an inductive load
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Figure 1: Al Bondwire
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Figure 1: Benefit of In-Design Technology in IC Design
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Figure 1: RX210 Block diagram
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Figure 1 - Supplies are margined by changing the resistor connected to the Trim/FB node
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Figures 1 &2: Forward conduction characteristics comparison
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Figure 1: Thermostat with resistive- and capacitive-touch technologies
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Figure 1: Typical circuit protection design for switch-mode power supplies
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Figure 1: Simplified Block Diagram of Washing Machine
Photo by Solarion AG
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Figure 1 - Typical wind farm configuration
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Figure 1: I-V characteristics of 10ms half sine pulses at different peak currents. Curve (c) is slightly above, curve (d) is far above the destruction threshold.
ITT Interconnect Solutions' EVC series connectors
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Figure 1: 65W demo board of the TEA1733
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Figure 1: Noise Rejection Utilities
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Figure 1: 347W universal input PFC
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Figure 1: Effect on efficiency of reducing component size by increasing switching frequency
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Figure 1a: The effects of parallel connecting two power supplies without share control
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Figure 1a: Application reference design for air-conditioning systems
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Figure 2: Measured data for the Ericsson BMR450 20-Amp power module when varying input voltage from 4.5 to 14 volts and with load from zero to 20 Amps.
Figure 1: Schematic of an op amp
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Figure 1: LTC4070 application circuit operational modes
Medicine and computers converge
Figure 1: Voltage split forecast for the entry of compound semiconductor devices in PV inverters (Source: Yole Développement - November 2010)
PV installation and control system at the University
Figure 1: Sixpack Used as a Half Bridge
Figure 1: VCE(on) comparison of FS (Red), and NPT (Green) IGBTs
Figure 1: Crack in Ceramic (for clarity a MLCC is shown)
Figure 1: The design and optimization of a thermoelectric energy harvesting system is highly dependent on the relationships of these elements
Figure 1: Circuit diagram of flowNPC 0 module FZ06NPA070FP with parallel switch (combination of MOSFET and IGBT) as outer switch
Wafer storage facility in Santa Clara CA
Source: Ericsson
Figure 1: Topology of a high-efficiency AC-DC power supply
Figure 1: Talk time analysis of a 3G PA with and without FAN5902 under WCDMA signal modulation and 1000mAh Li-Ion battery. The power distribution function is DG09 and can be found in GSMA's white paper "Battery Life Measurement Technique, v4.7".
Figure 1: Traditional approach
Figure1: Block schematic of the IBA
Figure 1: Test data shows the capacitance effects of various overvoltage protection configurations
Figure 1: End-to-end efficiency in the traditional, 480V AC power distribution system
Figure 1: PI3101 complete power system
A Quality Management System for the Delivery of Products or Services (Source: International Organization for Standardization)
